BGA (Ball Grid Array) Packages are
created in EDWinXP from Package Editor of EDWinXP
Evoke EDWinXP: Start → Programs → EDWinXP → EDWinXP
Open Package Editor: Right clickLibraryand choose Library Editor.
Package Creation Wizard: FileNew → Package
Set the Package Name as BGA192/M19x19 and
Package type as Grid Array (PGA,BGA,..)as shown in the below
Here 192 denote number of pins in this package and
19x19 denotes the Pin Matrix of the package.
Click Next tab to continue.
In the Window, fill the required parameters as in
given below example:
No. of pins
Pin to pin Distance
Horizontal pitch between
Length of Package outline
Width Package outline
No.of Bottom Row Pins
BGA 192/e 50/M 19x19
is selected by double clicking on the field Default Padstack.
From the drop down menu select suitable
smd padstack. Click on Editor create new Padstack
to Make necessary changes to the padstack’s shape and size and click
Click on Accept selection button,
then automatically the padstack selected will be assigned as the Default
The resulting Screenshot is as shown below.
Double Click Package Type
field to select a Package Type. The window for selecting the package
type is displayed. From the drop down menu select SMD → BGA
and Click Accept as shown in below screen shot.
Click Next to continue to the next Step to
show the details of the created padstacks as shown in the below screen
Click Next to proceed
to the next step. In this step make necessary arrangements like Width, Length
and Offset values in X, Y Directions and to get the package preview
Click Next to proceed. The final window shows
the details of the created Package as shown below
and click Finish to finish creation.
Save the created package: From the
File Menu choose Save Package As BGA192/M19x19