News and Events |
The new Version, EDWinXP 1.80 released.
In
accordance with our practice applied in previous releases, we have selected
improvements for 1.80 basing on suggestions collected from EDWinXP users. Of
course, not all received suggestions could have been implemented yet. From
remaining suggestions, those that we see as feasible for implementation are in
the pipeline and shall be addressed in future releases. |
Download and Installing instructions of EDWinXP
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The latest version of
EDWinXP can be downloaded from our website
http://www.visionics.a.se/html/edwindemoform.html. This is an
evaluation version of EDWinXP. For downloading, please fill up
the form given there and submit it. The downloaded file will
be in compressed zip format.
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Testimonials |
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Testimonials of various EDWinXP users are provided here.
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Feature Comparison |
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The feature comparison of different modules in different version of EDWinXP
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Attention Windows Vista users!! |
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EDWinXP 1.71 runs under Windows Vista operating system.To install EDWinXP on vista machine please download EDWinXP 1.71 from www.visionics.a.se, if your EDWinXP CD shows error starting setup program.
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Simulation Models in EDWinXP |
EDWinXP is equipped with
two different simulation engines. First, we have Mixed-Mode
simulator that has been developed by Visionics. The other is
EDSpice simulator based on Berkeley SPICE3 with a number of
extensions and improvements. Both allow analysis of circuits
containing digital and analog elements.
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Exports and Imports in EDWinXP |
EDWinXP is equipped with
several export and output routines. Through export, certain
categories of data in project database may be extracted and
stored in formats that are readable by other CAM/CAD software
or directly by machinery used in manufacturing and testing of
printed circuit board. Imports are intended for transferring
projects from other, similar to EDWinXP software packages,
reverse engineering or as source for creating simulation
models.
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Reconstruction of layout components from graphic import(Part 1) |
Graphic imports and Reconstruct from graphics
are two features of Fabrication Manager allowing for reverse engineering of
printed circuit boards from artworks in Gerber ASCII formats.
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Reconstruction of layout components from graphic import(Part 2) |
Part 1 of this article described first of two methods that may be used for reconstructing components in projects reverse engineered from graphics imported from artworks in Gerber ASCII format. This procedure utilizes graphic elements in certain imported categories only as template for placing components that first have to be created in Layout Editor. In tutorial kit NWSTUTOR.ZIP , you will find sample project database NWSTUT_IMP1.epb that already includes all necessary imports – those categories that are mandatory for complete reverse-engineering of a board when above component reconstruction method is applied. The actual components have been created by importing EDWinXP format wire list. NWSTUT.WRL that is also included in the kit. This project is intended for user who would like to try this procedure on a simple example.
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Importing board outline and cutouts from AutoCAD |
Among data formats that
EDWinXP can import we have .DXF, two-dimensional output from
AutoCAD. This import is included as an option of Graphic
Imports and Reconstruct from Graphics features accessible from
Fabrication Manager.
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XSPICE CodeModel Subsys Software Design |
The description for the design of the models in XSPICE
(Georgia Institute of Technology) is available from the link.
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SPICE Home Page |
SPICE is a
general-purpose circuit simulation program for nonlinear dc,
nonlinear transient, and linear ac analyses. In EDWinXP, it
inherits EDSpice Simulator for the simulation of SPICE
programs.
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