EDWinXP is an EDA software package for automated design of electronic products. This integrated tool covers all stages of electronic design process -schematic capture, simulation, PCB layout design and generation of PCB manufacturing and testing. EDWinXP comes with a powerful set of features – User friendly Editors for Schematics, PCB Layout etc., 3D Viewers and Editors, VHDL Editor with facility of automatic project creation from VHDL source and Converters (CUPL, JEDEC, XILINX), Microcontroller Simulation using 8051, AVR, PIC, Motorola Microcontrollers, Board Analyzers, 3D Library Editor, Model Generators from VHDL for Mixed Mode and EDSpice Simulators with facility of automatic creation of model/ library along with other features. Apart from the major attraction, completely integrated design concept with Automatic Front and Back Annotation. EDWinXP supports Reverse Engineering – complete reconstruction of project database either using full set of artworks in Gerber ASCII format or complicated PCB Outline.
A portable integrated package viewer composed of Design Information and Documentation of a Project and a solution to maintain computerized technical documentation of your electronic projects.
DocOne is a tool to assist the Design Bureau/Designer in integrating all the required information of a device. DocOne can be used to pack an EDWin project with viewers for Schematic and PCB Layout and all the related documentation on a single CDROM.
The EDComX tool kit alleviates the time consuming process of creating both Code Models and User-Defined Nodes by automating the creation of standard files used to define Code Models and User-Defined Nodes. It achieves this by employing easy-to-use dialog windows for entering all relevant information. The ultimate aim of using EDComX is to generate Code Models and User-Defined Nodes as Windows DLLs.
Enterprise License Manager
Enterprise License Manager is a utility to keep check on the number of licensed users of EDWinXP in a network. It enables the users to activate EDWinXP in a networked environment.
EDWinNET 1.10 Deluxe version comes with all Standard features of EDWinXP. This is the conversion and movement of EDWinXP to a new platform, .NET. Circuit designs can be front and back annotated i.e. a design may be started either from Schematic Editor or PCB Layout and design information is automatically updated.
AsPacker is a tool to explore and develop bare Die wirebond solutions for PCBs, MCMs, Hybrids and Packages. AsPacker is a tool that aids the designer integrate bare die or chips into their design. It is fully programmable and flexible with many options to explore while trying to achieve the best design possible for your needs. High pin-out die can be a nightmare to deal with unless you have a tool like AsPacker do the work for you.