AsPackeris a tool to explore and develop bare Die wirebond solutions for PCBs, MCMs, Hybrids and Packages. AsPacker is a tool that aids the designer integrate bare die or chips into their design. It is fully programmable and flexible with many options to explore while trying to achieve the best design possible for your needs. High pin-out die can be a nightmare to deal with unless you have a tool like AsPacker do the work for you.
It is simple to use and easy to earn. Anybody wishing to take advantage of using bare die or chips in their designs will benefit by using Aspacker. It eliminates the guess work of hand editing by using design rules to drive the process. For advanced users it can be used in the design of Multi Chip Modules, Hybrids Circuits and Packages.
By using AsPacker, the time from start to finish is greatly reduced while increasing the design integrity and reliability. All commands are recorded as they are executed and can be edited and played back at any time. This makes the design process and set-up repeatable, reliable and reusable. Interface with EDWin is done by using an industry standard LIQ file format.
Original code stream was developed to assist MCM design houses in the early 1990’s. Second generation algorithms licensed to Mentor’s PADs and Synopsy's Sager systems and are still in use today. Third generation represents a complete rewrite of the algorithms to allow for a better user interface and integration of multiple tools into a single tool. Fourth generation continued to simplify the design process focusing more on the layout engineer eliminating parts of the code that dealt with ASIC design and tailored to work with EDWin.The fanout algorithms have been rewritten again to increasing the accuracy and reliability of the design process through the use of scripting and an easy to understand command language.
Patent Pending algorithm yields superior wirebond results like:
Algorithm places die bond pads into geographic groups based on distances between die bond pads and bonds out each group separately. Whereas other tools center the substrate pads at the geometric center of each side and evenly spread out the pads regardless of gaps between die bond pads. This
AsPacker iteratively looks at multiple solutions and interactions between groups to generate the best final solution.Total Maximum Iterations can be set (defaults to 100) and the tool will stop before the max iterations if the changes between iterations is less than a set parameter (defaults to .01 micron).